Products

ELECTRONIC PACKAGING

ANTI-STATIC METALLIZED BAG
Primary used


High-value water, semi-conductor wafer, precise electronic parts

or inductances of surrounding instruments, main board, IC board,

and general electronic components.
Specification


Physical Properties
Structure Unit ESD-T-PET-VM/PET-VM/PE-ESD
Thickness-mil(micron) mil (micron) 7.0 mil(178µ)+/-10%
Tensile Strength-psi(ASTM D882-91 Method A) psi MD:13000/TD:14500
Tear Strength-lbs(ASTM D1004-66 Method A) lbs MD:82.59/TD:106.8
Elongation-%(ASTM D882-91 Method A) % MD:70/TD:40
Light Transmission-%(ASTM D1003-92 ) % <0.01
Heat Seal strength-lbs./in.width(FTMS D 1876-93) lbs./in. width >199.3
Burst Strength-psi(FTMS 191-C Method 5122) psi >1851.2
Puncture Strength-lbs(FTMS 101-C Method 2065-1) lbs >712
MVTR-gms(ASTM F-1249@100F,100sq.in/24hrs) gms <0.002
Electrical Properties
EMI shielding-dB(Mil-B 81705-REV-C) dB 30
Capacitive Probe Test-volts(High Voltage Discharge
(EIA-Std541/Appendix E-1KV)
volts <15
Surface Resistivity-ohms/sq.in(ASTM D-257@15% R.H.)
Interior        Exterior       Metal
ohms/sq. in <10^8-10      <10^8-10     10^2-4
Static Decay-sec.
(FTMS 101C Method 4046-1,5000V to 0 Volts)
sec. <0.03

Others


1. 3.6 mil ANTI-STATIC METALLIZED BAG
2. 6.0 mil EMI STATIC SHIELDING BAG
3. 7.0 mil HIGH PUNCTURE RESISTANCE MOISTURE BARRSER BAG