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ELECTRONIC PACKAGING
- Primary used
Various IC board applications and
semiconductor packaging.
- Specification
Physical PropertiesStructure Unit ESD-PET-VM 100A//ONY//PE-ESD Thickness-mil(micron) mil (micron) 4.3mil(110µ)+/-10% Tensile Strength-psi(ASTM D882-91 Method A) psi MD：6505 TD：7820 Tear Strength-lbs(ASTM D1004-66 Method A ) lbs MD：41.35 TD：34.18 Elongation-%(ASTM D882-91 Method A) % MD：100 TD：70 Light Transmission-%(ASTM D1003-92 ) % <45 Heat Seal strength-lbs./in.width(FTMS D 1876-93) lbs./in. width >185.12 Burst Strength-psi(FTMS 191-C Method 5122) psi >783.2 Puncture Strength-lbs(FTMS 101-C Method 2065-1) lbs >204.31 MVTR-gms(ASTM F-1249@100F,100sq.in/24hrs) gms <0.15 Electrical PropertiesEMI shielding-dB(Mil-B 81705-REV-C) dB 45
Capacitive Probe Test-volts(High Voltage Discharge
(EIA-Std541/Appendix E-1KV)volts <20 Surface Resistivity-ohms/sq.in(ASTM D-257@15% R.H.)
Interior Exterior Metalohms/sq. in <10^8-10 <10^8-10 10^2-4
Static Decay-sec.
(FTM 101C Method 4046-1,5000V to 0 Volts)sec. <0.1
